Tutorial 1

Prof. Grant Covic,

The University of Auckland, New Zealand

Electric vehicle wireless charging systems for both a stationary and dynamic future

 

Date: Sunday 3 June 2018

Time: 2:00pm - 3:40 pm

 

Abstract:

The tutorial will give a sweeping overview of stationary electric vehicle wireless charging systems and finish with thoughts around the possibilities and future challenges of dynamic wireless charging. Starting with a brief history and fundamentals considered in design, it will move on to describe the simple light duty vehicle magnetics in use and the reasons. This will be followed by interoperable multi-coil topologies that may be suitable for high-power or misalignment tolerant applications and ferrite-less designs for in-road applications. The second half of the tutorial will discuss the vision of future roadway systems for both light and heavy duty applications, giving examples from the literature, and finish with an example of a taxi-rank evaluation system designed and developed at the University of Auckland. Recent successful dynamic trials undertaken by QualcommHalo will also be highlighted.

 

Biography of speaker:

Grant is a full professor at the University of Auckland. In the mid 90’s he began working with Prof. John Boys to develop the technology of resonant Inductive (contact-less) Power Transfer (IPT) for materials handling and electric vehicles (EVs) and in the early 2000’s they began jointly leading a team focused on AGV applications for traditional markets, and redeveloping EV charging solutions for private as well as public applications.

Today Grant’s research and consulting interests are focused on both industrial solutions using IPT and wireless charging of EVs under static and dynamic conditions. Over the past 15 years he has published more than 140 international refereed papers in this field, worked with over 40 postgraduates and filed over 40 patents, all of which are licensed to various global companies in specialised application fields.

In 2010 he co-founded (with John) a new global start-up company “HaloIPT” focusing on electric vehicle (EV) wireless charging infrastructure and was joint head of research from formation until sale. During this time HaloIPT received the Clean Equity Monaco award for excellence in the field of environmental engineering and two NZ clean innovation awards in the emerging innovator and design and engineering categories. Grant and John have been awarded the New Zealand Prime Minister’s Science Prize, the Vice Chancellors commercialisation medal and the KiwiNet research commercialisation awards for scientific research which has seen outstanding commercial success.

Grant is a senior member of IEEE and a Distinguished Lecturer of IEEE Transportation Electrification Community. He is also a fellow of both the Institution of Professional Engineers New Zealand, and the Royal Society of New Zealand. Presently he heads inductive power research at the UoA and co-leads the interoperability sub-team within the SAE J2954 wireless charging standard for EVs.

Tutorial 2

Dr. Daniel Kuerschner,

Qualcomm Halo Technology, Germany

Compliance and safety requirements of wireless electric vehicle charging systems and computer based design methods.

 

Date: Sunday 3 June 2018

Time: 4:00pm - 5:40 pm

 

Abstract:

The tutorial starts with introducing the Qualcomm Halo design process of wireless electric vehicle charging (WEVC) systems. It is presented, which sequential and also iterative steps are needed and included in the process and how those steps can be automatized by using a workflow combining ANSYS FEM simulation, MATLAB scripts and circuit simulation. For the design process the user defines several parameters, objectives and restrictions. Based on those, an algorithm seeks for target design candidates, which do meet a set of performance, compliance and safety requirements. For WEVC systems, such compliance and safety requirements for example are meeting a maximum magnetic leakage field (EMC/EMF) at a defined distance and also meeting a maximum magnetic flux density on the base pad surface (thermal safety). In the tutorial, reasonable assessment approaches and limits for the listed requirements are derived and proposed. Specifically, in the area of EMC it is explained why existing approaches for a compliance evaluation cannot be used for WEVC systems. Because of the working principle and the specific operation conditions of WEVC systems (e. g. required magnetic field in the air gap, resonance operation) it is concluded and suggested that the existing assessment methods must be adjusted, that the test setup and environment require further specification and that an additional limit margin might need to be introduced. In the tutorial, it is provided how these challenges are addressed in international WEVC and EMC standardization bodies. In the end, the presented methods for WEVC system design and compliance assessment are illustrated based on an example dynamic wireless charging system.

 

Biography of speaker:

Daniel Kuerschner received Diploma and Ph.D degrees in electrical engineering from the Otto-von-Guericke-University of Magdeburg in 2005 and 2009, respectively. He worked in the field of wireless power transfer at the Institut f. Automation und Kommunikation (Magdeburg) from 2004-2011 and at Paul Vahle GmbH (Kamen) from 2011-2013. There, he was responsible for the design and the development of power electronics, passive components and the overall system for a wide range of applications, from milliwatt up to 100 kW power transfer. In 2013, he joined Qualcomm Halo (Munich) and is responsible for simulation, design and EMC/EMF of wireless electric vehicle charging (WEVC) systems. Daniel Kuerschner has more than 14 years of experience with inductive power transfer technology, particularly with power electronics, magnetics, electromagnetic compatibility and simulation methods. In these fields he has published more than 30 scientific papers and he gave more than 40 lectures at workshops, seminars and conferences. For more than 10 years he is member of several scientific and industrial panels and standardization bodies, such as IEEE, SAE, CISPR and German VDE, ZVEI and DKE.